Company Introduction
MGC was established in 2012, and its team has over 18 years of professional experience in front-end semiconductor process equipment. The core products of MGC include temporary wafer bonding and debonding(TBDB), permanent bonding processes such as Thermo-Compression Bonding (TCB), Laser-Assisted Bonding (LAB), and Hybrid Bonding (HB), as well as Nanoimprint Lithography (NIL) equipment, vacuum alignment systems, Pod/Foup cleaners, and vacuum wafer laminator systems. MGC is dedicated to providing high-throughput production equipment and total process solutions, widely applied in the manufacturing of semiconductors, compound semiconductors, IGBT devices, nano structures (AR/VR), solar energy, Micro LED, and 3D and advanced packaging technologies.
Business philosophy
We adhere to integrity and focus on the development of nanoimprinting and optoelectronic semiconductor process equipment. Quality is the principle of work and service. Customer satisfaction is the specific practice pursued by the company. We have an eye on the world market, international managers, focus on long-term strategic partners, and the pursuit of sustainability.
