核心技術 Core Technology
Application field：
Wafer bonding： Thinning process（Si, SiC）
Nano imprint： AR, VR, DFB Laser, VCSEL, Micro LED, Solar, Waveguide, PCB Interposer, IC pattern.
| Product | Description |
|---|---|
| Wafer Bonder | Temporary Bond、LAB (Laser Assisted Bond)、Thermal Bond、Hybrid Bond、Direct Bond |
| Nano Imprint Lithography (NIL) | Stamping machine、Fully automatic stamping machine、Manual stamping machine |
| Cleaner | 12” Foup cleaner、8” cassette cleaner（Class 1） |
| Laser Bonder | Die to Wafer LAB |
| Hot Plate | Vacuum hot plate、Vacuum oven |
| O2 Plasma | Single-wafer plasma cleaning、Batch type |
